Front mounted power switch. from ELMA Electronic Inc. It features 4 slots of 3U VPX on 1 in. 100G Ethernet Data plane. VME 11; PCI Express 10; cPCI 3U 9; 3U VPX 8; Software 6; Thunderbolt 3 6; VXI 6; 3U 5; cPCI 6U 5; PCI 4; ISA 3; Mini PCI Express 3;. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. For example, developments can begin on the bench with 6-slot air-cooled systems and then migrate to 12-slot 19" rack equipment or conduction-cooled ATR solutions while using the same plug-in card. Because VITA 48. With moveable rear profiles (up to 2. The XPand1303 is a low-cost, flexible, development platform. The ICE-Lok® can be seamlessly. 1/2 ATR, conduction-convection cooled. or 1. The planar heat pipes are also called vapor chambers which are used as. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. Conduction cooled ATR and 19” rackmount chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. 62. For ATR, 19” chassis and box solutions; VPX, VME, Compact PCI, VXI… Backplane as well as MOTS (Modifiable of the Shelf) carrier board solutions MIL-38999 connectors Conduction-cooled and air-cooled design Third party module integration; Development platforms space-saving modular design approach to provide the highest flexibility for the. Therefore, the VME community and the military users developed the technique of conduction cooling. And with now-available high I/O VPX boards, there will be more PCIe lanes than ever traveling around a VME chassis; that’s why it’s critical to make sure those PCIe lanes. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. Configure your VME SYSTEM. Chassis Type: ATR Chassis Cooling: Forced Air Module Cooling: Conduction Number of Slots (1″ pitch): Various Operating Temp. SOSA Products. 3U Air cooled models available in 1. Full environmental sealing insures reliable operation in any. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). Ordering Information: Dawn P/N 11-1017632-01. Another popular VMEbus card style is the conduction cooled module. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. Our selection of Intel, NXP Power. The heat from the internal conduction-cooled modules is. 08 of Vita65. Aitech’s C162 is a high-performance 6U VME SBC for embedded and harsh environment applications. 0 specification. The VT874 provides three AMC mid-size slots that can accept any AMC. It is conduction-cooled through the card edge/wedgelock. 3) CompactPCI Serial is an industrial standard for modular computer systems. Input Voltages: 85-264 VAC, 5. 8 does not use module-to-chassis conduction cooling, it also promises to help drive innovative use of new lightweight polymer or composite material-based chassis. Heat frames can be designed for compliance with IEEE 1101. Open VPX backplane with VITA 62 power slot. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Victoria BC : 250-727-2890 ©2010 A&A Perfomance Chassis: Site Design by. Learn About Us. CPCI Chassis . Architecture: VPX/OpenVPX : Cooling: Liquid-Cooled : Depth: 12. PXI Express Chassis. PXI /. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. Product Information ATR Chassis For Conduction-Cooled VME Boards Available in multiple ARINC 404A sizes: 1ATRLong, 1ATRShort, 3/4ATRShort, 1/2ATRShort Choice. 11 system management, OpenVPX tier 2 chassis manager, VPX, conduction cooled, SOSA - Pixus Technologies. nVent SCHROFF offers two 19" chassis platforms, MultipacPRO and Interscale, both with options for various. From conduction cooled to air cooled, from simple passive (power burning) resistor boards to active, monitored and controlled load boards, the customer has a variety of load board solutions to choose from. Standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. Conduction Cooled Version of Pixus VPX Chassis Manager. High-Performance Cooling with 8 fans in Push/Pull. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Wire-free design. Revolutionary design allows for up to 175 watts per slot of conduction cooling. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 0 specification for use in. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. 2, AMC. Over the evolution of its near 40 years of existence, VME-bus has become a worldwide standard and is still used in a wide variety of applications across many different markets. 3-n. Includes one solid state Disc Drive Carrier mounted on the side behind front I/O panel. Learn more about Hartmann Electronic's card guide with a conduction cooled cold plate 50HP for Open Frame Chassis, 5HP slot pitch. 3 V. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. -199 in order to ensure interoperability and common good practices. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. For a chassis with sealed side walls and lid. Terminal, 8 slots: On-board Schottky barrier diodes. New High-Density 3U VPX Switches and Chassis Support Dual 100Gb Ethernet, 8x Gen4 PCIe, or 16 LVDS. 19" Chassis. 3U Conduction Cooled VPX Extender. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. 5A, 3. Mounting Style: Desktop. Built with aluminum the chassis are suitable for rugged airborne applications and can operate in under extreme temperatures, dust and humidity. The power supply is thermally attached to the bulkheads for heat removal. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. The card slots within a chassis hold the heat frames that PCB boards attach to. 48. Status LED indicators allow users to verify proper Operating Temperature: -4 to 122 F; Type: Rack. Home. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. COTS approach to conduction cooled modular computers COTS mechanical rules for conduction cooled modular board computers in the eurocard form factor were standardized in 199 by IEEE Std 1101. Type 12R2, 9U, 19" Rackmount, MIL-Rugged, Vertical Chassis. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system. VITA 66/67 and HOST/SOSA options available. {Tower-Desktop-Industrial-Rugged-[Military] to 901D} Extreme Engineering Solutions {VPX and CompactPCI Development Platforms, Deployed Systems, ATR, rugged, air- and conduction-cooled, Integrated Systems} Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. 05 G2/Hz-IS to $5_C 2 (,]o_) Table I -DSS Requirements Summary A block diagram of the DSS is shown in Figure 4. It is based on the established PICMG 2. This rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. VXS (VME Switched Serial) represents an extension of the VME family according to VITA 41. Description. It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. Air-Cooled Scroll Modular. 2. 2. 3U CompactPCI. 12”W x 19. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. Intel®. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. μTCA. • Drive Bay: None Installed. 3U/6U (VPX / cPCI/ VME) Backplane Options. Convection, conduction and liquid cooled ATR enclosures support a wide-range of applications for Land, Air and Sea. Terminal, 8 slots: On-board Schottky barrier diodes. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. downloads. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. 0 specification for use in Mil/Aero VPX systems. 3/4 OpenVPX / SOSA ATR Development Chassis. CompactPCI Serial Chassis. Backplane: Custom 6U, 10 slot open VPX Backplane (Dawn P/N 08-1017654 Rev. Dawn VME Intelligent 6U 1600W VITA 62 DC wedgelock conduction cooled power supply (i. Height: 7. Hartmann Electronic designs and manufactures high speed backplanes, electronic Chassis, and more for micro-computer. Dawn’s embedded RuSH technology provides intelligence for precision monitoring and control. Application. 0 in. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. 10 Slot VME Rugged ATR SIGINT Chassis 10U VME64X Ground Mobile Rugged Enclosure 11 Slot SOSA Development System. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. True 6-Channel design provides full OpenVPX. heat to the chassis walls and finally to a cold plate. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. 8-inch pitch backplanes. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. 1 compliant cPCI, 2 through 8 slots, 32 bit or 64 bit configurations, +5VIO or +3. 62H. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. Conduction Cooled Version of Pixus VPX Chassis Manager. 0 specification for use in. Maximum power dissipation depends on cold plate. or 1. Backplanes options - cPCI, PCI, VME64x, VME/VME64, VPX and custom. +85°C. 1 PICMG 2. 3U / VITA 62 / 800W. PSU, open frame, 444 W (400 W at < 180 VAC) Backplane VME 8 slot, 6 U, J1/J2 monolithic in accordance with VITA 1-1994. With moveable rear profiles (up to 2. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. VME / VME64x Chassis. Thermal design, simulation and analysis services. Chassis GND: Continuous chassis GND surface where backplane is mounted to rack, comes with M3 screw for chassis GND. This Model Can be used to design the VITA Card Chassis. Aids in locating hot spots in the chassis. Curtiss Wright. CP931FP is a 6U CompactPCI managed Layer 2, 3, and 4 switch with 24 10/100BaseTX ports and 2…. Description. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. X-ES / Extreme Engineering Solutions XPand4200 Standard Sub-1/2 ATR Forced Air-Cooled Chassis for Conduction-Cooled Modules. 2 restricts air flow to the card edges where it’s cooling impact is limited and so conduction cooling and air cooling solutions are usually considered mutually exclusive. 88 in. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. 3V. 6U Conduction Cooled VPX Extender. We offer a wide range of ATR chassis that are convection, conduction cooled and liquid cooled. An open-frame solution for the open-minded engineer. They can be used to power a VPX chassis and will fit into the. (Table 3) The PCI sub-system can support from 2 to 9 PMCs within a standard VME chassis (see P0CC1 datasheet for more detail). They are designed for circuit boards. 2. allows VME, cPCI and other boards to fit within conduction cooled chassis slot dimensions with zero insertion force. . Related To: Dawn. 3/4 ATR, conduction-convection cooled. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. The modular power supply can be configured with AC or DC filtered inputs. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. 3V_Aux. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. The PSC-6238 front I/O. High Quality Chassis and Enclosures for VME and VME64x Applications. Dawn’s VITA 62 compliant 6U PSC-6265 can operate continuously in diverse environments over a wide range of temperatures at high power levels. Performs an amazing range of applications, and tests such as OpenVPX Rule Compliance testing and certification, system design validation and characterization. C: -40 Operating Temp. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. The PSC-6236 offers current sharing with up to four power supplies in a system for outputs of 12V, 5V and 3. 8 (. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. The Open Frame Chassis have built in manual controlled 120mm front fans and monitoring for fan and voltages. 62” deep without handle) Customized Front Input/Output (I/O) Panel; Connector layout per customer requirement (option per MIL-DTL-M38999) Meets MIL-STD-810F for. 3VIO, Short tail connectors on J1, long tail connectors on J2. FREMONT, Calif. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. View product. XCalibur1931. The VT874 is designed for the rugged extremes of avionics, naval, and ground vehicles applications. 8” slot. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. 6U / VITA 62 / 580W. The convection bridge is. Example: 44KS2 +5 VDC to +3. About. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 3U/6U High ATR Chassis with upto 15 Slots Card Area. (Table 3) The PCI sub-system can support from 2 to 9 PMCs within a standard VME chassis (see P0CC1 datasheet for more detail). It does not store any personal data. NAI’s 44KS2 is a 75-Watt DC/DC Converter that plugs directly into a standard 6U VME chassis with an 0. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction cooling rather than utilizing active systems such as forced. 11 compatible rear Transition Module card cage. VME / VME64x Chassis. The C6100 can be installed into any IEEE 1101. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through internal. • Designed for conduction cooled CPCI VME, VXS, VPX and custom boards • Lightweight construction. Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. 2). VME VME P2 Figure 3: PPCM1 I/O Diagram Ruggedization Levels PPCM1 is available in Radstone’s 5 environmental ruggedization levels (see Table 1). The most rugged packaging for computing. CompactPCI Serial Chassis. VXS uses a straightforwardFPGA-Based VME Bridge; IPMI for VPX Systems; Cisco IOS-XE® Embedded Services Routing; Built-In Test (BIT) coreboot & FSP for Intel; Green Hills INTEGRITY. The 6023 bin for 6U or 9U cards bin in addition to the 2U high fan tray space a 1U air compression chamber below the front card cage. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. Conduction-Cooled. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. (H) Four 0. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 5"L x 5. 4+ years of experience assisting electromechanical and mechanical applications. Files (3) VPX VITA CARD 3U /. RCOM05 6U CPCI, 6U VME 5 295 x 160 x 248 CPCI, VME Conduction Cooled Dual in; 16-40V DC 65W<br /> RCOM05-ATR-6V Other 5 194 x 124 x 320 CPCI, VME Conduction Cooled 16-40V DC 300W<br />. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. They are low-power system-on-chip (SoC. Our VME and mezzanine switches and routers provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit Ethernet links. The crate offers 9 VME64x slots in a compact designed chassis with integrated low noise power supply and cooling fan. 2. Conduction Cooled. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. The Dawn PSC-6236 can be special ordered to support high current single channel applications. Please contact us using the form to the left or at 407-845-1700 to discuss your requirements in detail. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in VPX, VME and CompactPCI systems. 10 Mechanical standards; 6U (VXS/ OpenVPX/VPX/VME64x / cPCI) Backplane Options; 1U to 11U High Card Area; 2 to 21 Slots; Custom specific Switch Controls and indications; Forced Air Convection Cooled; AC / DC Input power supply; EMI/RFI. 8 in. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. 66A steps, 3V3_VS2 0A. Find VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of VME Chassis information. 9 mm) Design Feature: Tolerance Compensating. Meets ARINC 404A and. Operating Temperature > 8 slots: 0°C. 1, AMC. The Isothermal Card Edge (ICE)-Lok® is designed to enhance thermal performance for conduction-cooled embedded computing systems. The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. It can withstand extreme environmental conditions such as temperature, shock, vibration. 3U CompactPCI 2. PXI /. Embedded RuSHTM technology. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. This platform conforms to VITA 1. 3 VDC output at 75 Watts. Agnostic OpenVPX embedded computing cooling technology from Mercury Systems can be packaged as circuit board-only, Air Flow-By and Liquid Flow-By, conduction cooled and Liquid Flow-Through, Air. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. 2 (REDI) and VITA 65 (OpenVPX™) † 6U, 7-slot backplane, 1” pitch per VITA 65 Backplane Profile BKP6-CEN07-11. CPCI Chassis. 6U CompactPCI. Over the evolution of its near 40 years of existence,. VPX-4U-Chassis-Datasheet. Output Voltages: 12V/50A, 3. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of. This 4U x 19-inch deep chassis can either be mounted in a 19-inch rack or used as a table top unit. In order to facilitate conduction cooling, we make a thermal contact between the card (heat source) and the conducting blocks. Subrack based, sheet metal, desktop or tower configurations. This platform conforms to VITA 1. AccessoriesConduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. 08/03/20231 ATR Liquid Cooled : Extended Description: This modular design ATR holds conduction cooled modules with independent dual liquid cooled side walls and a field-proven High Integrity Frame construction. or 1. The system is designed with enhanced EMC features. Ability to work with existing board, frame, or chassis designs. Compared to conventional wedgelocks, the ICE-Lok® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Available in 3U or 6U form factors, the conduction-cooled chassis support a wide range of architectures, including VPX, VME, VME64x, VXS, and CompactPCI. VME and VME64x VPX Systems Hardware Platform Management Components - AdvancedTCA. Relative Humidity: 90. VPX-REDI defines design parameters for enhanced cooling features and maintenance strategies to effectively support the increased power draw of high-density electronic systems. Input range is 85-264 VAC, 47-400 Hz. 0 in. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid VME64x/VITA46/48 VPX 5-slot Development System VME-VME64 6U 162 Series. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a. Verifies chassis can meet power requirement and specifications for VPX. (COTS) and customized conduction. 0 specification for use in Mil/Aero VPX systems. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the. Shutdown control for each power rail. It consists of a tunable laser(s), i wavelength tagging Michelson intefferometer, an optical distnl_Jti_“The solution there is primarily conduction cooling, dissipating 100 to 150 watts per enclosure, with a ceiling of more than 40 watts per slot in a 6U form factor. 0 - 7. Load sharing circuitry for up to 4 modules. High Quality Backplanes for VXS Applications. Standard features include protection against transients, overvoltage. The convection bridge is clamped between the VME. For all rugged environments: Air, Land, and Sea. 10-core processor for high performance. VPX combines best-in-class technologies to assure a very long technology cycle. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. All prices are shown in USD. (W) x 5. The CHAMP-XDx family of modules features some of the most sophisticated thermal frames yetW-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 62H. 6U VPX & VME Systems. Abaco Systems' range of development chassis allow system integrators to evaluate products in a laboratory environment, secure in the knowledge that the same cards can be ordered in different ruggedization levels to meet the demands of many deployed environments, from benign air cooled, to fully rugged conduction cooled. CompactPCI Serial Chassis. 2 specification. It can be installed in any standard conduction cooled VME chassis. Rugged Rackmount. Conduction Cooled VMEbus Modules. 52”L x 7. The newest VITA specification is VPX. 103-7620-001_E. The tubular heat pipes typically have outer diameters from 1/16″ (1. Any kind of project specific variations can be provided on request. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. 10/. Backplane is Fabric Mapping Module overlay-ready and configurable to meet any data plane connection fabric. PICMG 2. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction CooledWatch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. Airstack ® air-cooled modules are available in a wide range of capacities and with tandem scroll compressor sets to create chillers with a 10 to 600 ton. 0 specifications. Designed for rugged conduction cooled assemblies (CCAs) in VPX systems,. Conduction cooled base coupled, via short and efficient path, provides for optimum cooling. VME64x 2U/84HP 4 Slots. These PSUs are available in 3U or 6U form factor. 0 specification for use in. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. January 25, 2021. The Chassis CPU will monitor and maintain the VPX module wedge temperature, set by the user which allows testing of the conduction cooled modules without going through the. Enclosures that accommodate up to twelve 3U and 6U VME, CompactPCI and VPX conduction-cooled boards. As VXS is based on a 0. It supports up to two 0. Revolutionary design allows for up to 175 watts per slot of conduction cooling. sets itself apart from other rugged electronic packaging suppliers by specializing in engineered packaging solutions, primarily for military, heavy industrial and aerospace applications. Designed to meet the requirements of VITA 62 for use in harsh environments. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. Universal AC Input. Conduction cooled ATR and 19” rackmount chassis for VPX, SOSA-aligned, VME, cPCI and ATCA architectures. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. 08 of Vita65. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Subrack based, sheet metal, desktop or tower configurations. Related To: Dawn VME Products6U VME64x 195-x Mini Chassis. Single/dual cooled side walls. The wedge locks are seated in card slots on the chassis, which . Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. Any kind of project specific variations can be provided on request. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. Reverse side wedge locks. Cooling: Conduction cooled. Works With: Conduction Cooled Enclosures Clamp Force: 300 – 399 lbf / 136 – 181 kg Gap Width: PCB + (0. CompactPCI Serial Chassis. 8” slot. The stronger the need for computer power, the more. Onboard embedded RuSH™ technology actively monitors voltage, current, temperature and provides protective control. 1‐1994. 8” pitch versus a typical 1. Operating temperature range: -40°C to +85°C. Rugged Conduction Cooled Assemblies and Modules. The XPand1203 is a low-cost, flexible, development platform. CompactPCI Serial Chassis. or 1. 3) CompactPCI Serial is an industrial standard for modular computer systems. PXI /. LONDON--(BUSINESS WIRE)-- nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries. 6″ form factor. 10/11; Backplane conforms to VITA 1. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. (ACT) is a premier thermal management solutions company, focusing on custom applications of two-phase heat transfer technology. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). The chassis interface 400 comprises convection bridge heat exchanger 402, standard 6U VME electronics module 404, a heat flow 406, an air flow 408, a card slot pitch height 410, generic 6U VME backplane 420, generic 6U VME connectors 412, a modified chassis side panel 414, a wedgelock clamp 416, and non-conduction-cooled standard. Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. ACT developed an integrated design and delivered turnkey parts that were developed to be highly ruggedize and provided thermal conductivity > 750 W/m-K.